DATE: 23 May 2022
Op-ed | How edge computing can help clean up the packaging industry
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How edge computing can help clean up the packaging industry 

By Daniel Saito, CEO and co-founder at StrongNode 

As the world becomes increasingly digitized, the packaging industry must adapt to new demands to remain competitive. One way that companies are doing this is by turning to edge computing. In this Expert View, Daniel Saito, CEO and co-founder at StrongNode, examines how edge computing can help the packaging industry reduce its carbon footprint and become cleaner.