IDTechEx explores advanced semiconductor packaging materials
14 Aug 2023 --- Two key metrics, bandwidth and power efficiency, are crucial to determine the success of advanced semiconductor packaging solutions, finds technology company IDTechEx. The company discusses material requirements for achieving higher bandwidth, one of the essential factors for improved communication between dies.
With high demand for improved performance and efficiency in electronic devices, the semiconductor industry is pushing the boundaries of packaging technology. In the context of interconnected dies on a package, the system’s performance relies on the signaling within the package.
Bandwidth is a critical performance metric in advanced semiconductor packaging. It refers to the amount of data transmitted or communicated between the dies on the package. Higher bandwidth allows faster and more efficient communication, enabling devices to process data at high speeds, explains the technology company.
Two primary factors are considered to measure bandwidth: IO/mm and Datarate/IO. IO/mm represents the density of input/output (I/O) connections available on the die edge, while Datarate/IO refers to the data transfer rate of each I/O terminal measured in bears per second.
Exploring alternative dielectric materials
The performance of IO/mm and Datarate/IO strongly relies on the redistribution layer (RDL) within the package. Essential features of the RDL, such as Line/Space (L/S), via, and pad dimensions, play a crucial role in achieving optimal performance and data transmission within the package.
The dielectric constant of materials in the redistribution layer (RDL) directly impacts the datarate/IO. Currently, the finest L/S of RDL can be attained using inorganic dielectrics like SiO2, but the material’s relatively high dielectric constant makes it unsuitable for high-speed communication. Additionally, the process is also challenging and costly.
As a result, researchers are actively exploring alternative dielectric materials, particularly organic options, which offer the advantages of lower dielectric constants and reduced costs. When selecting organic dielectric materials, several key parameters must be considered to ensure their suitability for the packaging process, concludes IDTechEx.
In related news, Taiwan Semiconductor Manufacturing Company invested nearly NT$90 billion (US$2.9 billion) to build an advanced chip packaging plant in Taiwan.
Meanwhile, Silicon Box, a Singapore-based semiconductor integration start-up, launched its US$2 billion advanced semiconductor manufacturing foundry to “revolutionize” the chip manufacturing sector, reduce packaging size, build local jobs and boost Singapore’s position as a global hub for semiconductor manufacturing.
Edited by Natalie Schwertheim
