Highcon New Folding Carton Die-cutter and Xerox’s Automated Packaging Solution

Highcon and Xerox both have a keen understanding of the market requirements for innovative ways to differentiate products, short run packaging to support inventory and cost management, as well as regional, local and low-volume products.

4 May 2012 --- Highcon has announced its new Direct-to-Pack solution for folding cartons that can complement the Xerox Automated Packaging Solution which includes the Epic CTi-635 In-Line Coating System and Stora Enso Gallop Buffering Stacker Line and DC58 Die Cutter. This digital folding-carton cutting and creasing solution will bring efficiencies to converters looking to extend the digital technology into the finishing process. Highcon is pleased that the company has been working together with Xerox Corporation to perform digital cutting and creasing on folding carton packages printed on the Xerox iGen4.

Powered by Highcon’s patent-pending Digital Adhesive Rule Technology (DART) the Highcon Euclid uses precision laser optics and polymer technologies to transform cutting and creasing from an analogue to a digital workflow, dramatically streamlining the finishing process. This revolutionary new technology offers brand owners and converters faster and more responsive delivery, increased versioning, shorter run lengths and more creative designs.

Highcon and Xerox both have a keen understanding of the market requirements for innovative ways to differentiate products, short run packaging to support inventory and cost management, as well as regional, local and low-volume products.

“We are convinced that the Highcon Direct-to-Pack solution will be a game-changer for the folding carton package printers,” said Chris Baker, Highcon VP Sales & Business Development.  “The synergy between the two companies and their solutions is immediate.”

Folding carton samples that prove the design flexibility and creativity required by today’s market will be shown at the companies respective booths at the drupa show in Dusseldorf, Germany, May 3rd to 16th.