Micron Technology is establishing a new high-bandwidth memory (HBM) advanced packaging facility, reportedly the first of its kind in Singapore. Operations are scheduled to begin in 2026, and Micron’s total advanced packaging capacity will be expanded beginning in 2027 to meet growing demand for AI. “As AI adoption proliferates across industries, the demand for advanced memory and storage solutions will continue to increase robustly,” says Sanjay Mehrotra, president and CEO of Micron.
