Toppan purchases Japanese site to establish high-density semiconductor packaging facility
07 Dec 2023 --- Toppan is building a factory for the development and mass production of next-generation semiconductor packages in Nomi, Japan. The company has entered into a sale and purchase agreement with OLED (organic light-emitting diode) developer and manufacturer Joled for the land and buildings at the Joled Nomi site.
The printing technologies company plans to use the site to develop next-generation technology and construct a mass production line for Flip Chip Ball Grid Arrays (FC-BGAs) that meet the demand for high-speed transmission and chiplet use.
FC-BGAs are high-density semiconductor packages for which significant growth is anticipated due to increased demand centered on use for data centers and generative AI. Toppan expects to launch the new line in 2027 and is considering the production of its existing electronics products at the Nomi site.
High-speed, large-volume demand
With society’s digitalization progressing at a fast pace, the volume of data traffic is increasing every year, stresses Toppan. This development focuses attention on 2.xD packages and other next-generation semiconductor packages that respond to needs for high-speed, large-volume transmission, explains the company.
Toppan is currently expanding FC-BGA production capacity at its Niigata Plant in Japan, but room for future expansion is limited due to increasing demand. The company has therefore been considering how to secure a new production base and identified Joled’s Nomi Site as a location that meets the requirements for next-generation semiconductor package manufacturing processes.
The company will use digital twin, factory automation and AI technologies to target the launch of a state-of-the-art facility that reduces the need for human resources and drives high production efficiency.
Edited by Natalie Schwertheim
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