ProPak Asia 2026
Date
10 Jun 2026 - 13 Jun 2026
Organizer
Informa Markets

Machinery & Automation
AI and data optimization propel packaging material reduction innovation
AI and data utilization are increasingly important for improving material efficiency in the packaging sector, according to industry experts. At the same time, ongoing technological advances are enabling packagers to develop...

Machinery & Automation
SEMICON Japan 2025 live: Boschman showcases silver sintering for semiconductor packaging
At SEMICON Japan 2025 in Tokyo, Boschman Advanced Packaging Technology is presenting its patent technologies, including its silver sintering system, a die attach technology in semiconductor packaging.Sintering is a thermal...

Machinery & Automation
Billerud invests in headbox upgrade to boost product strength
Billerud is installing a new headbox on its paper machine to enhance the strength, quality consistency, and performance of the company’s flagship product, Billerud Flute. The move aims to strengthen Billerud’s...
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