AI and data utilization are increasingly important for improving material efficiency in the packaging sector, according to industry experts. At the same time, ongoing technological advances are enabling packagers to develop...

At SEMICON Japan 2025 in Tokyo, Boschman Advanced Packaging Technology is presenting its patent technologies, including its silver sintering system, a die attach technology in semiconductor packaging.Sintering is a thermal...

Billerud is installing a new headbox on its paper machine to enhance the strength, quality consistency, and performance of the company’s flagship product, Billerud Flute. The move aims to strengthen Billerud’s...