ACG Packaging launches lightweight cold-form blister packaging
Key takeaways
- ACG Packaging has introduced SuperPod, a cold-form blister packaging solution that reduces material usage.
- The multilayer laminate of SuperPod offers cold-drawing capabilities, allowing it to be used for vitamins and supplements.
- SuperPod supports sustainability with small and smart packaging formats, enhanced protection, and compatibility with existing high-speed packaging lines.
ACG Packaging Materials has launched SuperPod, a cold-form blister packaging solution. It enables blister cavities to become “dramatically smaller” through material reduction, while maintaining barrier performance and machine runnability.
SuperPod has a multilayer laminate that offers cold-drawing capabilities alongside the protective qualities of aluminum. It is suitable for vitamin and supplement applications.
Dr. Akbar Ali, general manager and head of development and technology at ACG Packaging Materials, says: “We’re excited to debut SuperPod at Pharmapack 2026. The technology effectively reduces the weight of cold-form blisters by reducing material usage per dosage.”
“We see significant opportunities, particularly for high-count formats such as 20-count vitamins and B-complex capsules, where traditional cold-form blisters become impractically large.”
“It also performs exceptionally well for moisture-sensitive and oncology products, where reduced headspace and narrower cavity spacing help minimize gas and moisture exposure, offering enhanced protection.”
Small and smart options
ACG Packaging Materials explains that SuperPod is compatible with existing high-speed packaging lines. The pharma solution is also available with PVC-based and halogen-free sealing layers.
Jochen Scheil, VP for Global Sales and Business Development, says: “The launch of SuperPod encourages the industry to rethink decades-old design conventions and embrace smaller, smarter, and more sustainable blister formats. Digital tools such as QR codes and electronic leaflets further support this transition by reducing reliance on large blister surface areas for printed information.”
Smart packaging tools are increasingly popular, particularly tracking systems that monitor recyclability or food waste.
A recent study found that intelligent packaging features, such as integrated biosensors and IoT platforms, can significantly reduce food waste by monitoring food quality and spoilage.
Meanwhile, a new Avery Dennison report found that digital identity solutions in F&B packaging enable retailers to improve product traceability and reduce food waste.
