Asmpt Amicra and Teramount partner to fight challenges in silicon photonics packaging
26 Sep 2023 --- Asmpt Amicra and Teramount are teaming up to connect fibers to silicon photonic chips and packaging to meet growing bandwidth demands in datacom and telecom applications. With AI and high-performance networking rapidly developing, the companies highlight that one of the main challenges has been to achieve seamless fiber-to-chip connectivity.
The collaboration between the two companies is based on the placement of Teramount’s wafer-level self-aligning optical elements on customers’ silicon photonics wafers. It uses Asmpt Amicra’s advanced precision die attach machineries, enabling a solution to this challenge.
“There is a clear demand from customers for high-volume silicon photonics manufacturing and packaging,” says Hesham Taha, Teramount’s president and CEO.
An integrated circuit is a chip containing electronic components that form a functional circuit, such as those embedded inside smartphones, computers and other electronic devices. A photonic integrated circuit is a chip that contains photonic components, which are components that work with light (photons). In a photonic chip, photons pass through optical components such as waveguides (equivalent to a resistor or electrical wire), lasers (equivalent to transistors), polarizers and phase shifters.
Silicon photonics is a material platform from which photonic integrated circuits can be made. It uses silicon on insulator wafers as the semiconductor substrate material, and most of the standard complementary metal-oxide semiconductor manufacturing processes can be applied.
“They are keen to see this supported by equipment already used in high-volume outsourced semiconductor assembly and test environments. Asmpt Amicra, a die-to-wafer attach equipment company, is an ideal partner for Teramount to scale up and meet this rising customer demand.”
Asmpt Amicra is a global supplier of ultra-high precision die attach equipment specializing in ultra-high precision die attach solutions and Teramount is a “leader” in scalable fiber connectivity to chips.
“Silicon photonics is the key technology of our future everyday life. The fast transfer of constantly growing amounts of data requires ever-increasing accuracy when assembling the semiconductor components,” underlines Dr. Johann Weinhaendler, managing director of Asmpt Amicra.
“In Teramount, we see an optimal expert in the development of high-speed connectivity solutions where we meet each other to incorporate their products via high-precision passive wafer-level assembly of optical lens components.”
Edited by Natalie Schwertheim
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