26 Sep 2023 --- Asmpt Amicra and Teramount are teaming up to connect fibers to silicon photonic chips and packaging to meet growing bandwidth demands in datacom and telecom applications. With AI and high-performance networking rapidly developing, the companies highlight that one of the main challenges has been to achieve seamless fiber-to-chip connectivity. The collaboration between the two companies is based on the placement of Teramount’s wafer-level self-aligning optical elements on customers’ silicon photonics wafers. It uses Asmpt Amicra’s advanced precision die attach machineries, enabling a solution to this challenge. “There is a clear demand from customers for high-volume silicon photonics manufacturing and packaging,” says Hesham Taha, Teramount’s president and CEO.
