ProSweets 2012: Bosch to Showcase First Single-Wrap Die-Fold Package with Hermetic Seals

Bosch Packaging Technology will present its first single-wrap die-fold package with hermetic seals at ProSweets 2012 in Cologne. Now, chocolate manufacturers no longer have to sacrifice product quality and maximum shelf life for a strong visual impact.

Bosch Packaging Technology will present its first single-wrap die-fold package with hermetic seals at ProSweets 2012 in Cologne. Now, chocolate manufacturers no longer have to sacrifice product quality and maximum shelf life for a strong visual impact.

The hermetically sealed single-wrap die-fold package with only one film allows for maximum product safety. The pack style is produced by the Starpac 600 HL, a machine developed by Sapal, a Bosch Packaging Technology company, and is compatible to run polypropylene film (OPP). The addition of heat-sealed and airtight hermetic seals to die-fold packages maintains product freshness for increased shelf life and protects the product against insects and moisture. It also strongly preserves original aromas and flavors while denying penetration by external scents, such as from nearby products on store shelves. Consumers receive a tamper-proof yet easy-open package due to the machine’s automatic application of tear-tape to the packaging material.

The Starpac 600 HL wraps small- to medium-sized chocolates efficiently with an output of up to 600 pieces per minute. To maintain the elegant appearance of die-fold packages, the Starpac 600 HL uses a folding box to create all folds at once for perfectly symmetrical side and longitudinal seals. This symmetry is achieved by the folding box’s ability to maintain the precise position of wrapping materials with elastic properties, which cannot be ensured with multi-station folding. Not only does this feature ensure aesthetically pleasing packages but also maintains high seal integrity and minimizes material consumption.

The Starpac 600 HL and pack style will be on display in Bosch’s booth (Hall 10.1, Booth C010-D011), 29 January - 1 February 2012, Cologne.

Source: Bosch Packaging Technology