Quantum Leap Packaging Announces Industry Breakthrough in Plastic Hermetic Packaging

QLP’s proprietary material, Quantech, can be tailored to meet specific properties and performance requirements such as CTE, temperature stability, thermal conductivity and electrical performance.

30/03/07 Quantum Leap Packaging, Inc. a leading provider of high performance, air cavity packages for semiconductor assembly announced the availability of HermeTech, the industry's first hermetic plastic package that meets JEDEC standards. QLP is manufacturing HermeTech plastic air cavity QFNs that maintain hermetic leak rates of less than 5x10-8 atm cc/s He, and pass full Mil Spec reliability tests.

Through a combination of its unique Quantech material technology, and innovative UltraSeal ultrasonic lid process, QLP has developed HermeTech plastic hermetic QFNs that feature tailorable properties, low moisture permeability and high temperature stability that enable true hermetic performance.

"We are pleased to offer HermeTech, the industry’s first plastic hermetic package which combines the hermetic performance and reliability of ceramic packages with the design flexibility and tailored material properties of Quantech to solve longstanding packaging problems." said David Grooms, CEO of Quantum Leap Packaging. "I see QLP's breakthrough technology leading the next generation of semiconductor packaging."

Ideal for advanced packaging applications such as Image Sensors, HB-LEDs, MEMs, LDMOS and RF Microwave devices, QLP’s HermeTech QFNs provide packaging solutions to critical needs such as low stress packaging and improved thermal performance. Hermetic levels have never been achieved with organic materials. Traditional plastic packages such as epoxy transfer mold fail because of poor moisture absorption and other material issues such as stress and non-linear properties. Similarly, standard plastic air cavity packages have exposed leak paths at the lead frame-polymer interface and poor lid seal methods that fail to achieve hermetic performance.

QLP’s proprietary material, Quantech, can be tailored to meet specific properties and performance requirements such as CTE, temperature stability, thermal conductivity and electrical performance. The combination of QLP's Quantech material technology, engineering design, and proprietary processes enable QLP to successfully develop and manufacture HermeTech - the first plastic hermetic packaging in the semiconductor packaging industry.