Name: IC Packaging Technology Expo
Start: 2010-01-20T00:00:00
End: 2010-01-22T00:00:00
Location: Tokyo International Exhibition Center (Tokyo Big Sight) 3-21-1 Ariake, Koto-ku, Tokyo, Japan

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Events

IC Packaging Technology Expo

Date

20 Jan - 22 Jan, 2010

Location

Tokyo International Exhibition Center (Tokyo Big S...

Organizer

Reed Exhibitions Japan Limited

inw-e@reedexpo.co.jp

Website

http://www.icp-expo.jp/en/

Square promotional banner for Aicompsummit featuring the headline “What drives digitalization? Digital solutions for the packaging industry” and inviting users to join for free video on-demand access.

KHS industrial filling and packaging machine illustration promoting Interpack 2026 event with date and hall location details.

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