Name: IC Packaging Technology Expo
Start: 2012-01-18T00:00:00
End: 2012-01-20T00:00:00
Location: Tokyo International Exhibition Center (Tokyo Big Sight), Tokyo, Japan

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Berlin Packaging expands spirits portfolio with lightweight PET and customizable glass
EU weighs PPWR compliance relief as cross-border small businesses face costs
The cherry on top: Bakery packaging puts visual appeal at the center of recyclable design
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Beauty & self care
Beverages
Bioplastics
Caps & closures
Compostables
Design & branding
E-commerce
Electronics
Fashion & textiles
Fiber-based
Flexible plastics
Food
Foodservice
Glass
Household
Industrial
Labels & labeling
Machinery & automation
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Pet food
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Berlin Packaging expands spirits portfolio with lightweight PET and customizable glass
EU weighs PPWR compliance relief as cross-border small businesses face costs
The cherry on top: Bakery packaging puts visual appeal at the center of recyclable design
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Trending now
Berlin Packaging expands spirits portfolio with lightweight PET and customizable glass
EU weighs PPWR compliance relief as cross-border small businesses face costs
The cherry on top: Bakery packaging puts visual appeal at the center of recyclable design
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Berlin Packaging expands spirits portfolio with lightweight PET and customizable glass
EU weighs PPWR compliance relief as cross-border small businesses face costs
The cherry on top: Bakery packaging puts visual appeal at the center of recyclable design
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Berlin Packaging expands spirits portfolio with lightweight PET and customizable glass
EU weighs PPWR compliance relief as cross-border small businesses face costs
The cherry on top: Bakery packaging puts visual appeal at the center of recyclable design
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Berlin Packaging expands spirits portfolio with lightweight PET and customizable glass
EU weighs PPWR compliance relief as cross-border small businesses face costs
The cherry on top: Bakery packaging puts visual appeal at the center of recyclable design

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Events

IC Packaging Technology Expo

Date

18 Jan - 20 Jan, 2012

Location

Tokyo International Exhibition Center (Tokyo Big S...

Organizer

Reed Exhibitions Japan Limited

info@reedexpo.co.jp

Website

http://www.reedexpo.co.jp/english/

ICP - IC PACKAGING TECHNOLOGY EXPO is the most significant exhibition specialised in IC Final Manufacturing, (assembly, test and packaging). ICP gathers all lines of equipment, materials, manufacturing & testing services for manufacturing of fast-developing ICs such as SIPs, WCSPs, BGAs, FCs, etc. And held together is the SUBCONTRACTOR ZONE featuring the World's TOP companies in IC design, assembly and testing services.