Name: IC Packaging Technology Expo
Start: 2014-01-15T00:00:00
End: 2014-01-17T00:00:00
Location: Tokyo International Exhibition Center (Tokyo Big Sight) Tokyo, Japan

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Events

IC Packaging Technology Expo

Date

15 - 17 January 2014

Location

Tokyo International Exhibition Center (Tokyo Big S...

Organizer

Reed Exhibitions Japan Limited

info@reedexpo.com

Website

www.reedexpo.co.jp/en/

ICP - IC PACKAGING TECHNOLOGY EXPO is the most significant exhibition specialised in IC Final Manufacturing, (assembly, test and packaging). ICP gathers all lines of equipment, materials, manufacturing & testing services for manufacturing of fast-developing ICs such as SIPs, WCSPs, BGAs, FCs, etc.