Coveris banner promoting Packaging Innovations 2026, featuring recyclable packaging products and event details for 11–12 February at NEC Birmingham, Stand J114.
Home
Events
IC Packaging Technology Expo

IC Packaging Technology Expo

Date

15 - 17 January 2014

Location

Tokyo International Exhibition Center (Tokyo Big S...

Organizer

Reed Exhibitions Japan Limited

Email

info@reedexpo.com

Website

www.reedexpo.co.jp/en/

Image
Subscribe to our newsletters
PlatformsFood Ingredients FirstNutrition InsightPackaging InsightsPersonal Care InsightsThe World of Food Ingredients
About usContact usAdvertisingPrivacy statementSitemapArchive
Follow us
linkedinrss_headergoogle_news
Image