Name: IC Packaging Technology Expo
Start: 2015-01-14T00:00:00
End: 2015-01-16T00:00:00
Location: Tokyo International Exhibition Center, Japan

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Events

IC Packaging Technology Expo

Date

14-16 Jan 2015

Location

Tokyo International Exhibition Center, Japan

Organizer

Reed Exhibitions Japan Ltd.

info@reedexhibitions.com

Website

www.reedexpo.co.jp/en/

High-quality and sustainable banding solutions for your packaging in sales and logistics

Upcoming events

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2026

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