Name: IC Packaging Technology Expo
Start: 2015-01-14T00:00:00
End: 2015-01-16T00:00:00
Location: Tokyo International Exhibition Center, Japan

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Berlin Packaging expands spirits portfolio with lightweight PET and customizable glass
EU weighs PPWR compliance relief as cross-border small businesses face costs
The cherry on top: Bakery packaging puts visual appeal at the center of recyclable design
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Berlin Packaging expands spirits portfolio with lightweight PET and customizable glass
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The cherry on top: Bakery packaging puts visual appeal at the center of recyclable design
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Berlin Packaging expands spirits portfolio with lightweight PET and customizable glass
EU weighs PPWR compliance relief as cross-border small businesses face costs
The cherry on top: Bakery packaging puts visual appeal at the center of recyclable design
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Berlin Packaging expands spirits portfolio with lightweight PET and customizable glass
EU weighs PPWR compliance relief as cross-border small businesses face costs
The cherry on top: Bakery packaging puts visual appeal at the center of recyclable design
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Berlin Packaging expands spirits portfolio with lightweight PET and customizable glass
EU weighs PPWR compliance relief as cross-border small businesses face costs
The cherry on top: Bakery packaging puts visual appeal at the center of recyclable design
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Berlin Packaging expands spirits portfolio with lightweight PET and customizable glass
EU weighs PPWR compliance relief as cross-border small businesses face costs
The cherry on top: Bakery packaging puts visual appeal at the center of recyclable design

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Events

IC Packaging Technology Expo

Date

14-16 Jan 2015

Location

Tokyo International Exhibition Center, Japan

Organizer

Reed Exhibitions Japan Ltd.

info@reedexhibitions.com

Website

www.reedexpo.co.jp/en/

ICP - IC PACKAGING TECHNOLOGY EXPO is the most significant exhibition specialised in IC Final Manufacturing, (assembly, test and packaging). ICP gathers all lines of equipment, materials, manufacturing & testing services for manufacturing of fast-developing ICs such as SIPs, WCSPs, BGAs, FCs, etc.