Name: IC Packaging Technology Expo
Start: 2015-01-14T00:00:00
End: 2015-01-16T00:00:00
Location: Tokyo International Exhibition Center, Japan

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Research & science

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Must read

Amazon US holiday season consumer survey reveals major interest in sustainable packaging

European Bioplastics conference 2024: Zhongke Guosheng Technology talks furan-based pack potential

Avantium increases financing package for its flagship plant to €46M

Must read

Amazon US holiday season consumer survey reveals major interest in sustainable packaging

European Bioplastics conference 2024: Zhongke Guosheng Technology talks furan-based pack potential

Avantium increases financing package for its flagship plant to €46M

Must read

Amazon US holiday season consumer survey reveals major interest in sustainable packaging

European Bioplastics conference 2024: Zhongke Guosheng Technology talks furan-based pack potential

Avantium increases financing package for its flagship plant to €46M

Must read

Amazon US holiday season consumer survey reveals major interest in sustainable packaging

European Bioplastics conference 2024: Zhongke Guosheng Technology talks furan-based pack potential

Avantium increases financing package for its flagship plant to €46M

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The world of food ingredients

Advertising options

Editorial enquiries

Must read

Amazon US holiday season consumer survey reveals major interest in sustainable packaging

European Bioplastics conference 2024: Zhongke Guosheng Technology talks furan-based pack potential

Avantium increases financing package for its flagship plant to €46M

Must read

Amazon US holiday season consumer survey reveals major interest in sustainable packaging

European Bioplastics conference 2024: Zhongke Guosheng Technology talks furan-based pack potential

Avantium increases financing package for its flagship plant to €46M

Suppliers

Supplier profiles

Must read

Amazon US holiday season consumer survey reveals major interest in sustainable packaging

European Bioplastics conference 2024: Zhongke Guosheng Technology talks furan-based pack potential

Avantium increases financing package for its flagship plant to €46M

Home EventsIC Packaging Technology Expo

IC Packaging Technology Expo

Date

14-16 Jan 2015

Location

Tokyo International Exhibition Center, Japan

Organizer

Reed Exhibitions Japan Ltd.

info@reedexhibitions.com

Website

www.reedexpo.co.jp/en/

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