Bosch to Exhibit Two-in-One Biscuit System at Pack Expo

Following a highly successful field test with leading international manufacturer of biscuits and cakes United Biscuits, Bosch Packaging Technology for the first time showcases its innovative Two-in-One biscuit packaging system to the North American market at PACK EXPO Las Vegas 2015.

With state-of-the-art product handling, horizontal flow wrapping and secondary packaging equipment, the system is designed for gentle and versatile wrapping and case packing of even the most delicate biscuit products. A customized field test at United Biscuits in Manchester, United Kingdom, effectively handled the primary and secondary packaging of the manufacturer's McVitie's Jaffa Cakes brand in different formats and sizes.

“What we found is that the very fast changeovers we saw at Interpack actually can be translated into the industrial environment,” said Simon Breckenfield, strategic capability controller at United Biscuits. “During the field test, we were able to take 100 percent of the McVitie's Jaffa Cake output through a single machine, and our view at the moment is that it has been a very successful project. It has allowed us to take our productivity and flexibility to the next level, as well as delivering a route-to-market solution our commercial teams were calling for.”

Unprecedented versatility in record time
At United Biscuits, the line packaged McVitie's Jaffa Cakes in both slug and pile configurations with different cake counts for limited edition flavors. The Two-in-One biscuit packaging system achieves high-speed, fully reproducible changeovers by using the same feeding components for both pile and slug packs, increasing productivity and uptime. It is the only system of its kind capable of changing the pile configurations in record time. No matter if 1, 2, 3, 4, 5 or more biscuits are required, pile packages with a maximum height of 50 millimeters (about two inches) are possible.

“We developed the Two-in-One biscuit packaging system as our response to a growing retailer and consumer demand for flexible packaging formats, like smaller on-the-go and larger family packages,” said Daniel Bossel, product manager at Bosch Packaging Technology.

Seamless, hygienic and one of a kind
A gentle handling philosophy across the line ensures minimized damage hazards and product contact, making the Two-in-One biscuit packaging system suitable for even the most fragile, brittle products. Additionally, three-dimensional product inspection technology detects broken biscuits and sorts them out. The hygienic design prevents the buildup of crumbs and allows for easy cleaning, facilitating a continuous production and maximized uptime. As part of Bosch's Seamless Systems portfolio, the speeds of all line components are balanced to eliminate bottlenecks and optimize production flow, from distribution to secondary packaging. The integrated design concept with the same look and feel across the entire line with standard operating procedures makes the entire system as simple to operate as a single machine, reducing the risk of operator errors.

”After changing from pile to slug packs, all an operator needs to do is press a button and the machine goes straight away,” said Breckenfield. “Our operators and engineers loved operating the machine! Having been with the business for 36 years and worked with equipment before, I have never seen a machine that is able to do what this machine can do with such panache. We now have a solution for many of the challenges that will face us in our business going forward.”

Complementing primary packaging, the biscuit system is designed for a wide range of case packaging formats for RSC or HSC cases (Regular and Half Slotted Containers) with retail-ready functionality. The case erecting, robotic loading and optional case closing units are all integrated in the case packer, resulting in a reduced footprint.

To find out more about how biscuit manufacturers can increase their productivity with the Two-in-One biscuit packaging system visit Bosch at PACK EXPO in Las Vegas, Nevada, September 28 to 30, 2015 in the Central Hall, booth C2800.

Source: Bosch Packaging Technology