25 Sep 2024 --- At the ongoing FachPack 2024, in Nuremberg, Germany, Gerhard Schubert is introducing and displaying its range of packaging innovations, focusing on machine-compatibility and environmental credentials. These include its Dotlock technology, a glue-free bonding method for cardboard packaging. On the show floor, Packaging Insights speaks with Matthias Thor, a consultant at Schubert, about the potential applications and impact of the new solution.
