Name: 19th IC & Sensor Packaging Technology Expo
Start: 2018-01-17T00:00:00
End: 2018-01-19T00:00:00
Location: Tokyo Big Sight,Japan

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Events

19th IC & Sensor Packaging Technology Expo

Date

17 Jan 2018 - 19 Jan 2018

Location

Tokyo Big Sight,Japan

Organizer

Reed Exhibitions Japan Ltd

isp@reedexpo.co.jp

Website

http://www.reedexpo.co.jp

Square banner promoting AICOMP SUMMIT, March 11–13, 2026, focused on digital solutions for the packaging industry with live streaming and video on demand.

KHS industrial filling and packaging machine illustration promoting Interpack 2026 event with date and hall location details.

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