Name: 19th IC & Sensor Packaging Technology Expo
Start: 2018-01-17T00:00:00
End: 2018-01-19T00:00:00
Location: Tokyo Big Sight,Japan

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TotalEnergies Corbion highlights PLA as a solution to global plastic waste pollution
Coca-Cola calls back packaging reuse target, NGOs demand leadership initiative
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TotalEnergies Corbion highlights PLA as a solution to global plastic waste pollution
Coca-Cola calls back packaging reuse target, NGOs demand leadership initiative
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TotalEnergies Corbion highlights PLA as a solution to global plastic waste pollution
Coca-Cola calls back packaging reuse target, NGOs demand leadership initiative
Unilever seeks SPEX solutions for hard-to-recycle plastic with Dutch scale-up partner
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TotalEnergies Corbion highlights PLA as a solution to global plastic waste pollution
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Unilever seeks SPEX solutions for hard-to-recycle plastic with Dutch scale-up partner
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TotalEnergies Corbion highlights PLA as a solution to global plastic waste pollution
Coca-Cola calls back packaging reuse target, NGOs demand leadership initiative
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TotalEnergies Corbion highlights PLA as a solution to global plastic waste pollution
Coca-Cola calls back packaging reuse target, NGOs demand leadership initiative
Unilever seeks SPEX solutions for hard-to-recycle plastic with Dutch scale-up partner

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Nutrition & health

Personal care & cosmetics

Policy & regulation

Research & science

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Must read

TotalEnergies Corbion highlights PLA as a solution to global plastic waste pollution

Coca-Cola calls back packaging reuse target, NGOs demand leadership initiative

Unilever seeks SPEX solutions for hard-to-recycle plastic with Dutch scale-up partner

Must read

TotalEnergies Corbion highlights PLA as a solution to global plastic waste pollution

Coca-Cola calls back packaging reuse target, NGOs demand leadership initiative

Unilever seeks SPEX solutions for hard-to-recycle plastic with Dutch scale-up partner

Must read

TotalEnergies Corbion highlights PLA as a solution to global plastic waste pollution

Coca-Cola calls back packaging reuse target, NGOs demand leadership initiative

Unilever seeks SPEX solutions for hard-to-recycle plastic with Dutch scale-up partner

Must read

TotalEnergies Corbion highlights PLA as a solution to global plastic waste pollution

Coca-Cola calls back packaging reuse target, NGOs demand leadership initiative

Unilever seeks SPEX solutions for hard-to-recycle plastic with Dutch scale-up partner

Publication

The world of food ingredients

Advertising options

Editorial enquiries

Must read

TotalEnergies Corbion highlights PLA as a solution to global plastic waste pollution

Coca-Cola calls back packaging reuse target, NGOs demand leadership initiative

Unilever seeks SPEX solutions for hard-to-recycle plastic with Dutch scale-up partner

Must read

TotalEnergies Corbion highlights PLA as a solution to global plastic waste pollution

Coca-Cola calls back packaging reuse target, NGOs demand leadership initiative

Unilever seeks SPEX solutions for hard-to-recycle plastic with Dutch scale-up partner

Suppliers

Supplier profiles

Must read

TotalEnergies Corbion highlights PLA as a solution to global plastic waste pollution

Coca-Cola calls back packaging reuse target, NGOs demand leadership initiative

Unilever seeks SPEX solutions for hard-to-recycle plastic with Dutch scale-up partner

Home Events19th IC & Sensor Packaging Technology Expo

19th IC & Sensor Packaging Technology Expo

Date

17 Jan 2018 - 19 Jan 2018

Location

Tokyo Big Sight,Japan

Organizer

Reed Exhibitions Japan Ltd

isp@reedexpo.co.jp

Website

http://www.reedexpo.co.jp

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