Name: 19th IC & Sensor Packaging Technology Expo
Start: 2018-01-17T00:00:00
End: 2018-01-19T00:00:00
Location: Tokyo Big Sight,Japan

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Events

19th IC & Sensor Packaging Technology Expo

Date

17 Jan 2018 - 19 Jan 2018

Location

Tokyo Big Sight,Japan

Organizer

Reed Exhibitions Japan Ltd

isp@reedexpo.co.jp

Website

http://www.reedexpo.co.jp

Upcoming events

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JAN

2026

Gulfood 2026

Dubai World Trade Centre, Sheikh Zayed Road, Dubai, United Arab Emirates

FEB

2026

Packaging Innovations & Empack 2026

NEC, Birmingham, UK

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