Name: IC Packaging Technology Expo
Start: 2013-01-16T00:00:00
End: 2013-01-18T00:00:00
Location: Tokyo International Exhibition Center (Tokyo Big Sight) Tokyo, Japan

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Events

IC Packaging Technology Expo

Date

16 - 18 January, 2013

Location

Tokyo International Exhibition Center (Tokyo Big S...

Organizer

Reed Exhibitions Japan Limited

info@reedexpo.com

Website

www.reedexpo.co.jp/english/

TT Talks podcast-style promotional graphic with microphone illustration and tagline “Sharp insights, real debate” by Taghleef Industries at Interpack

Sealed Air display featuring Cryovac and Liquibox packaging solutions, including vacuum-sealed meats, pumps, and recycle-ready materials, promoting Interpack 2026 Düsseldorf event

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