Aicomp Summit 2026 preview: Experts to explore how AI and digital platforms drive regulatory compliance

The upcoming Aicomp Summit in Vienna, Austria, March 11–13, will spotlight the latest software solutions shaping the packaging industry, with machine learning for regulatory compliance set to take center stage. 

“The Aicomp Summit was created to give paper and packaging manufacturers an insight into the latest digital innovations for their industry. It also aims to facilitate direct exchange at a high professional level,” Patric Klatte, head of marketing at Aicomp, tells Packaging Insights. 

“With this year’s Aicomp Summit, we have raised the bar even higher. More manufacturers will be represented at the event. We have also gained more partners who will be presenting interesting opportunities.”

Klatte says this year’s edition marks a transition from an Aicomp customer-focused to an industry-wide event.

Mondi, Constantia Flexibles, Smurfit Westrock, T.CON, MM Group, Saica, and Domino Printing are among the packaging companies attending the event.

“The focus on digitalization clearly distinguishes the Aicomp Summit from other industry events in the packaging industry. The Aicomp Summit is not a dull B2B event. We want to have fun at a high professional level,” adds Klatte.

He expects participants to exchange ideas and gain insights in an entertaining way. “I am particularly pleased that we will see many of the hotly debated topics presented at the summit with corresponding solutions.”

AI for regulatory compliance

Patric Klatte, head of marketing at Aicomp.Klatte says that summit attendees will have the chance to learn more about how AI adoption can help packagers ensure compliance with the EU’s Packaging and Packaging Waste Regulation (PPWR).

“Anyone who follows current trends will notice that topics such as PPWR and AI are currently receiving a lot of attention. We will highlight these topics in presentations at the summit.”

The event speakers set to explore the topic include packaging software experts Bart Verbruggen, senior manager at OMP, and Timo Klemm, chief of sales and marketing officer at X-IT. Manfred Tacker, CEO at the business consultancy Circular Analytics, will also share his insights.

“PPWR drives data requirements. Data enables AI. AI needs platforms. Platforms need integration. And all of it needs people who are brought along on the journey,” asserts Klatte.

“The summit speakers will present concrete solutions that packaging manufacturers can directly incorporate into their considerations.”

Beyond AI and regulatory compliance, the summit will explore broader topics driving the digitalization of the packaging industry.

“The Aicomp Summit addresses important aspects of change management and presents platform approaches that enable various solutions to be integrated into a harmonized system landscape,” says Klatte.