Fi Europe 2025: FoodChain ID highlights EU–US packaging compliance gaps and AI-driven R&D

At Fi Europe 2025, experts from FoodChain ID shared insights into the evolving intersection of packaging compliance and digital innovation. We spoke to Stuart Held, the company’s VP of Sales and Robert Nieuwerf, FoodChain ID’s...

SEMICON Japan 2025 live: Watttron talks heating tech for packaging and semiconductors

Klaudiusz Holeczek, business development manager and head of R&D at Watttron, presents the company's digital pixel-level heating technology. We explored how its precise thermal control enhances material efficiency and...

SEMICON Japan 2025 live: SEMI Europe calls for PFAS exemptions to maintain competitiveness

Stefano Ramundo Orlando, manager at SEMI Europe, discusses the PFAS Restriction Process under EU REACH. He talks to us about the regulation‘s impact and advocates for exemptions in the semiconductor sector, including advanced...

SEMICON Japan 2025 live: Xedion presents RFID-powered reusable box system

Harald Buchmann, member of the supervisory board at Xedion, discussed the latest RFID and sensor solutions. The company’s logistic reusable box system uses RFID technology to automatically reorder empty bins. It features easy...

Meadow pushes aluminum circularity with US production partnership

We speak to Victor Ljungberg, co-founder and CEO at Swedish packaging technology company Meadow, about its latest collaboration with Stephan Gould, a US-based packaging and supply chain solutions provider. We discuss scaling...

Amcor combines sustainability with advanced functional performance in paper

We explore the latest innovations in more sustainable paper-based packaging, including high-barrier, leak-resistant materials, with Nils de Rybel, senior research engineer at Amcor. Rybel discusses the technical challenges of...