Coveris banner promoting Packaging Innovations 2026, featuring recyclable packaging products and event details for 11–12 February at NEC Birmingham, Stand J114.
Home
Videos
SEMICON Japan 2025 l...

SEMICON Japan 2025 live: Xedion presents RFID-powered reusable box system

18 Dec 2025 | Xedion

Harald Buchmann, member of the supervisory board at Xedion, discussed the latest RFID and sensor solutions. The company’s logistic reusable box system uses RFID technology to automatically reorder empty bins. It features easy installation, RFID control software, and a lifting wagon for transferring bins.

More videos

Image