Name: Aicomp Summit 2026: T.CON talks digital manufacturing for corrugated packaging
Uploaded: 2026-03-17T00:00:00+00:00
Duration: 5 min 50 s
Description: We interviewed Jürgen Löw, director of business development at T.CON, to learn more about the company’s collaboration with SAP to develop digital manufacturing software for corrugated packaging facilities.

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Aicomp Summit 2026: T.CON talks digital manufacturing for corrugated packaging

17 Mar 2026 | T.CON

We interviewed Jürgen Löw, director of business development at T.CON, to learn more about the company’s collaboration with SAP to develop digital manufacturing software for corrugated packaging facilities.

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