Heating technology

On display at PACK EXPO will be the co.s thick-film heating technology that is used in numerous packaging applications to provide uniform heat with pinpoint accuracy at temperatures up to 500 deg C. The heating units can used for applications such as sealing protective film on thermoformed trays, cap sealing and using them on the face of seal bars used on horizontal, high-speed pouching machines.

On display at PACK EXPO will be the co.s thick-film heating technology that is used in numerous packaging applications to provide uniform heat with pinpoint accuracy at temperatures up to 500 deg C. The heating units can used for applications such as sealing protective film on thermoformed trays, cap sealing and using them on the face of seal bars used on horizontal, high-speed pouching machines. The Series SD family of PID temperature controllers can be used together with the thick-film technology to provide enhanced accuracy, the co. says.